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  • NEW Submission deadline: Apr 23, 2023 23:59 (GMT -0700)

  • Decision notification: May 24, 2023 23:59 (GMT -0700)

  • Final submission & copyright filing deadline: Jun 9, 2023 23:59 (GMT -0700)

Read the Author Information page to ensure that your submission meets the guidelines.

Papers must not exceed four A4 pages with all illustrations and references included.


Papers submitted for review must clearly state:

  • The purpose of the work

  • How and to what extent it advances the state-of-the art

  • Specific results and their impact


Only work that has not been previously published or submitted elsewhere will be considered. Submission of a paper for review and subsequent acceptance is considered as a commitment that the work will not be publicly available prior to the conference.


After selection of papers, the authors will be informed about the decision of the Technical Program Committee by e-mail by 24 May 2023.


At the same time, the complete program will be published on the conference website.

An oral presentation will be given at the Conference for each accepted paper. No-shows will result in the exclusion of the papers from any conference related publication.

The submitted final PDF files should be IEEE Xplore compliant.


For each paper independently, at least one (co-)author is required to register for the Conference

(one registration-one paper policy).


Registration fees and deadlines will be available on this website.




Although not limited, papers are solicited for the following main topics

1-Advanced Technology, Process and Materials

Process and material developments for logic, memory, and non-CMOS, including electrical and physico-chemical characterization, process integration and manufacturing: 2D TMDs and related insulators (e.g., hBN), graphene, TFTs, gate oxide, gate material, silicide, MOL and BEOL materials, 3D monolithic as well as conventional and novel memory cells including charge-based memories, ReRAM, MRAM, PCRAM, ferroelectrics, crosspoint and selectors, organic memory.

2-Analog, Power and RF Devices

From material growth to device, components, and systems (process, design, devices fabrication, applications). Device design and electrical/physical/electro-thermal/reliability characterization of devices based on Si RF CMOS, RF SOI, SiGe HBTs, SiC, InP/InGaAs/GaAs, AlGaN/InGaN/GaN, CNT, diamond and related material systems. Power systems integration issues including thermal management, packaging technologies, system-level electro thermal characterization, product quality and system reliability aspects. Device production processes and design for manufacturability.


3-Compact Modeling and Process/Device Simulation

TCAD and advanced simulation techniques and studies, compact/SPICE modeling of electronic, optical, organic, emerging, and hybrid devices and their IC implementation and interconnection. Verilog-A models of semiconductor devices (including bio/med sensors, MEMS, microwave, RF, high voltage and power, emerging technologies, and novel devices), parameter extraction, reliability and variability, performance evaluation and open-source benchmarking/implementation methodologies. Modeling of interactions between process, device and circuit design, design/technology co-optimization, foundry/fabless interface strategies. Numerical, analytical, statistical modeling and simulation of electronic, optical and hybrid devices, interconnect, isolation, and 2D/3D integration. Simulations of material properties and fabrication processes. Advanced physical phenomena (quantum mechanical and non-stationary transport phenomena, ballistic transport). Mechanical and/or electro-thermal modeling and simulation. Simulations of reliability aspects of materials and devices.



Amplifiers, drivers, comparators, filters, references, analog systems, and analog techniques.


5-Data Converters

Nyquist-rate and oversampling A/D and D/A converters. Capacitance-to-digital, time-to-digital, frequency-to-digital converters. Embedded and application-specific A/D and D/A converters. Analog to information conversion. A/D and D/A converter building blocks (sample-and-hold circuits, calibration circuits). Enabling new techniques, architectures, or technologies.


6-RF & mm-Wave

Building blocks operating at RF, mm-Wave and THz frequencies for wireless communication, radar, sensing, and imaging.

7-Frequency Generation Circuits

Oscillators and controlled oscillators, PLL, DLL, injection locked oscillators, frequency dividers, any kind of frequency generation or time base circuits and systems.

8-Digital Circuits & Systems

Digital circuits and memory subsystems for microprocessors, micro-controllers, application processors, graphics processors; digital systems for communications, video, and multimedia. Digital design techniques for power reduction, intra-chip communication, clock distribution, soft-error and variation-tolerant design, system-level integration.

9-Power Management

Power management and control circuits. Regulators. Switched-mode power converter ICs using inductive, capacitive, and hybrid techniques. Energy harvesting circuits and systems. Wide-bandgap topologies and gate-drivers. Power and signal isolators; robust power management circuits for automotive and other harsh environments. Circuits for lighting, wireless power and envelope modulators. Design for manufacturability

10-Wireless and Wireline Circuits & Systems

Wireless and wireline circuits and systems, 2.5/3D interconnect, copper-cable links, and equalizing on-chip links, exploratory I/O circuits for advancing data rates, radio transceiver SoC or SiP at RF/mmW and THz frequencies, chip to chip system communications, high speed serial interfaces, optical interfaces, established standards communication system full chip solutions.

11-Emerging and in-memory Computing Devices and Circuits

Advanced CMOS, post-CMOS, quantum computing, cryogenic circuits, novel device and circuit concepts that improve existing and enable novel computing paradigms. Advanced CMOS and beyond CMOS transistors (tunnel FET, negative capacitance FET), transistors based on low-dimensional systems (2D materials, nanowires, and quantum dots), and on topological insulators, as well as phase transitions transistors and all kind of circuit implementations with such devices. Qubit devices for quantum computing enabling and all related cryogenic circuits. Non-charge-based logic devices and circuits (magnetic logic, spintronics, and plasmonics).

12-Devices & Circuits for AI and ML 

Neuromorphic computing, AI accelerators, in-memory-computing, security. Emerging devices and materials in neuromorphic computing. New materials, and new uses for established materials, within the context of neuromorphic computing algorithms, ranging from deep neural networks (deep learning) to more bio-inspired networks and algorithms. Resistive switching materials, including phase change and ferroelectric materials for neuromorphic computing, materials for spintronic implementations of neuromorphic computing. Edge and cloud AI computing platforms. Silicon implementation of neuromorphic circuits, processors, systems and their applications. In-memory-computing and logic-in-memory. Phenomena, devices, circuits, and systems for IoT and IoE security (e.g., PUFs, TRNGs).

13-Devices & Circuits for Sensors, Optoelectronics & Display

Devices and circuits based on MEMS and bioelectronics devices for biomedical and imaging applications. Image sensors and related circuits and systems, SoCs. Automotive, LIDAR, and ultrasonic sensors for ADAS, autonomous driving, smart mobility. MEMS sensor systems. Wearable, implantable, ingestible electronics, biomedical SoCs, neural interfaces and closed-loop systems. Biosensors, microarrays, and lab-on-a-chip. Display electronics, displays with sensing functionality. Devices, circuits, and systems for AR/VR and related sensing/actuation. Product quality and reliability aspects. Device and circuits production processes and design for.

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