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Design IP Sharing and Chiplets





10:00 - 12:30



Room 5B


It is hard to overestimate the value of design IP exchange as it allows research teams to share their expertise and resources to create more advanced and innovative devices. In the meantime, IP sharing through chiplets and 3D integration is getting traction with the promise to reduce costs and improve performance in various application areas. This workshop will provide a thorough overview of existing software, hardware, and cutting-edge techniques enabling chiplets and 3D integration. It will also focus on the opportunities and challenges related to the Open-Source Hardware scene and present the roadmap for establishing a European design IP exchange repository. In the European semiconductor market, IP sharing and heterogeneous integration are now strongly supported by the EUROPRACTICE service. Since 1995 EUROPRACTICE has provided over 600 academic institutions and 300 SMEs in Europe with a full range of services to design and fabricate electronic components and systems, including design tools, fabrication technologies, and training courses. Attendees are encouraged to participate in the panel discussion at the end of the workshop, where experts in the field will share their vision about lowering the barrier to sharing design IP.


Romano Hoofman, Natalia Belova (imec, BE)

Romano Hoofman is Strategic Development Director at imec.IC-link since 2016. He is currently responsible for the innovation programs of the unit and for the coordination of the EUROPRACTICE Service. He started his career in industry, where he worked as a Principal Scientist at Philips Research and later on NXP Semiconductors. He covered many different R&D topics, ranging from CMOS integration, advanced packaging, thin film batteries, photovoltaics and (bio)sensors. Romano received his PhD from the Technical University of Delft in 2000, where he investigated charge transport in semi-conducting polymers. He has authored more than 30 publications and holds more than 10 patents in various research areas.


10:00 - 10:30

Introduction to EUROPRACTICE services
Romano Hoofman (imec, BE)

10:30 - 11:00

Software tools for 3D implementation

Mark Willoughby (UKRI-STFC, UK)

11:00 - 11:30

Open-Source Process Design status and roadmap for IHP BiCMOS technology

René Scholz (IHP, DE)

11:30 - 12:00

Chiplets integration and micro-transfer printing

How Yuan Hwang (Tyndall National Institute, IE)

12:00 - 12:30

Ongoing European initiatives to share design IP through repositories. The EUROPRACTICE and TRISTAN project cases.

Helio Fernandez Tellez (imec, BE)



Mark Willoughby has spent his entire career as part of the UKRI Microelectronics Support Centre (MSC), which he now leads. The MSC is an international centre of excellence in microelectronics design flows and allied areas from TCAD to system integration. Its major project is EUROPRACTICE, where it is the sole partner responsible for the supply and support of commercial microelectronics design tools to European academics and also leads the skills activity. In addition to the academic activities, the MSC is very active in assisting university spin-outs in microelectronics. Outside of work, Mark wonders why he has so little time outside of work and is never happier than when he has his head in a book.

Dr. René Scholz has been group leader of IHP's Research & Prototyping Service since 2004. His group is responsible for the organization of the MPW service and the development of process design kits for IHP's BiCMOS technologies. From 2001 to 2004, he was responsible for RF characterization and SiGe-HBT modeling at IHP. In 2008, he earned an MBA - Management for Central and Eastern Europe from the European University Viadrina Frankfurt (Oder).

How Yuan Hwang is currently a Senior Researcher in Tyndall’s Photonics and System Integration Group, developing wafer level photonics and optics integration technologies. He has worked in both public and private sectors in Singapore and Ireland over the span of 15 years, developing FO-WLP, power electronics and photonics integration technologies. He has 4 granted US patents and more than 30 publications.


Dr Helio Fernandez Tellez is a seasoned Program Manager at imec.IC-link, bringing over 20 years of extensive expertise in digital technology, innovation, and entrepreneurship. With a deep-rooted passion for strategy, innovation, technology, semiconductors, and digital technologies, Helio focuses on resolving intricate challenges linked to driving open innovation, and promoting cross-functional collaboration. Currently, as a Program Manager at imec, Helio oversees the design IP repository program, aligning with the objectives of the EU Chips Act. Previously, he held the position of Strategist at imec EDiT, where he played a role in shaping the group's strategic direction. Helio's academic background includes a Doctor of Philosophy (PhD) in Engineering from the Royal Military Academy in Belgium and a PhD in Life Sciences from Vrije Universiteit Brussel. Furthermore, he holds a Master's degree in Telecommunications and Electronic Engineering from Universidad de Málaga.

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