W2: Multi-gigabit optical communications for automotive
full day, 10:00
Automotive industry is moving towards autonomous driving, which demands a large amount of data to be processed. Optical interconnections are very well positioned because of the high required data rates for connecting sensors and electronic brains with superior EMC performance. Compared with data-centres, automotive applications require much wider range of operating temperatures (-40ºC to 125ºC) and superior reliability. A new optical physical layer standard has been developed, IEEE Std 802.3cz, supporting rates between 2.5 and 50 Gb/s. The workshop brings together points of view of the main actors involved in the complete solution, i.e. car manufacturer, network, ECU manufacturer, fibre cable interconnections, test and measurement, reliability, photonics and IC design as well as packaging.
Rubén Pérez – Aranda (KDPOF, ES)
Rubén Pérez-Aranda is KDPOF co-founder, where he is CTO. He has served +20 years as a profile manager of R&D projects for innovative digital communication systems, covering the path from information theory based research and innovation to the integrated circuits qualification and production.
His experience covers electronics and photonics device characterization, test and modeling, communications channel modeling, error correcting codes, advance modulations, channel equalization schemes, synchronization algorithms, timing recovery algorithms, signal integrity and electro-magnetics compatibility. He is co-inventor of 9 patents.
Rubén served as comment editor and editor-in-chief of the Gigabit Ethernet over Plastic Optical Fiber standard IEEE Std 802.3bv. Recently, he was main contributor in the development of Multi-Gigabit Optical Automotive Ethernet standard IEEE Std 802.3cz.
Rubén is IEEE Senior Member and Industrial Engineer with speciality on Electronics and Automatic Control (with honors) by Universidad Politécnica de Madrid, Spain.
10:00 - 10:15
Introduction and motivation of the workshop
Rubén Pérez – Aranda (KDPOF, ES)
10:15 - 10:55
Optical physical layer design and its standardization
Rubén Pérez – Aranda (KDPOF, ES)
10:55 - 11:35
980nm Photonic Components for Automotive Grade Interconnects
Joseph Pankert (TRUMPF Photonic Components, DE)
11:35 - 12:15
Glass Passive Optical Connectivity for Automotive Applications: Characteristics and Robustness
Dave Dawson-Elli (Corning, US)
12:15 - 13:30
13:30 - 14:10
Challenges for Optical Multigigabit Connectors and Cable assemblies in the Automotive Environment
Helmut Pritz, Rudolf Engl (MD ELEKTRONIK, DE)
14:10 - 14:50
Semiconductor qualification and reliability assessment for automotive
David Ortiz Rojo (KDPOF, ES)
14:50 - 15:30
Network level requirements and ECU level integration requirements for multi Gb/s links
Christian Klein (Bosch, DE)
16:00 - 16:35
Test and measurement solution overview for automotive optical PHY testing
Jae-Yong Chang (Keysight Technologies, US)
16:35 - 17:10
Automotive glass-fiber transceivers: Challenges in package development.
David Ortiz Rojo (KDPOF, ES)
17:10 - 18:00
Multi-gigabit optical IC design for automotive: design challenges and methodology
Alberto Rodríguez-Pérez (KDPOF, ES)
Joseph Pankert is VP of Product Management of TRUMPF Photonic Components, a 100% subsidiary of the TRUMPF Group that is entirely dedicated to VCSEL design, manufacturing, and marketing. Before, he was General Manager of Philips Photonics that was acquired by TRUMPF in 2019.
The OEM business within Corning Optical Communications provides micro optic and connectivity products to data and tele communications OEM equipment suppliers, and to customers with industrial applications requiring optical communications. Automotive in vehicle optical networking falls within this scope. Dr. Dawson-Elli has led market development for OEM since 2019. He has been with Corning for 30 years, and his technical background is materials and processing of thin inorganic films for optical and electronic applications. He has held leadership roles in corporate research, photonics (wavelength dispersion multiplexing and gain flattening filter products), display development (Lotus™ high performance display glass), environmental commercial technology (high porosity heavy duty diesel filters and Duratrap AT™) and corporate new business development. The common goals across these roles are to translate the attributes that matter in the customer’s application to product attributes of tangible, durable customer value. Then to utilize Corning’s strengths in materials, optics and manufacturing technology to invent, make and sell products that deliver customer value. His professional interest is in travelling the collaborative path to delivering such products, which is often non-linear, iterative, technical and creative.
Helmut Pritz was born in 1969 and grew up in Ampfing. He completed his studies in vehicle technology with a degree in engineering (FH) from the Munich University of Applied Sciences.
Mr. Pritz started his career at TRW Airbag Systems GmbH (now part of ZF Friedrichshafen). There he held various positions in the field of airbag gas generators and led a development team with 10 employees who developed products for international customers. After an internal change, Mr. Pritz was responsible for the global supplier planning for belt tensioners as well as the release of tools and supplier components. After changing to MD ELEKTRONIK GmbH in 2013, Mr. Pritz continued his career in the direction of on-board power systems. There he took the position of project manager in RF Technology, then led the RF technology department in R&D from 2015 - 2019 with a focus on high-speed data connections in automotive architectures. Since Mid-2019, he technical Product Manager for optical Data Transmission in the technical product management department.
Rudolf Engl was born in 1971 and grew up in Waldkraiburg, Germany. He completed his studies in electrical engineering with a focus on high-frequency engineering at the Ravensburg Berufsakademie, graduating as a Diplomingenieur (BA). Mr. Engl began his career as an electronics development engineer at Eurocopter (now Airbus Helicopters). Subsequently, he was able to deepen his knowledge of electronics through various automotive electronics developments for the companies Webasto, Beissbarth, or Atron. In addition to his development activities, he was usually also responsible for the project management of HW components such as the ticketing vehicle computer AFR4 of Atron electronic GmbH. With the change to MD ELEKTRONIK GmbH in 2013, Mr. Engl was entrusted with the development of various automotive USB electronic assemblies and took over the management of the electronics development department at MD Elektronik in 2018. At the same time, in addition to the electronics developments, different tasks in connector development projects were added to his area of responsibility. Since the beginning of 2020, he has been working with increasing intensity on the topic of optical data transmission in vehicles.
David Ortiz Rojo BS and MS degree in Telecommunication Engineering from Polytechnic University of Madrid with 25 years experience in semiconductor development leading multi-disciplinary teams. He is Semiconductor Automotive Functional Safety Professional since 2018. He started his professional career in SIDSA, where he worked as project manager and chip architect for medium and large size projects related with IPTV, and DVB technologies. In the last 12 years he has worked in KDPOF leading the IC development department and among others his responsibilities include IC architecture definition, reliability assessment, package design and IC production support. He is co-inventor of 2 patents.
Dr. Christian Klein is a senior manager in the automotive electronics division of the Robert Bosch GmbH. He has a PhD in Semiconductor Physics with a focus on high speed electronics.
Within Bosch he was responsible for the technology development of automotive electronic control units for 20 years working in different positions. Besides e-mobility applications, especially high speed electronics was his field of action. One central point he dealt with was the technology development of printed circuit boards. Now Christian Klein is leading a development project to enable the next generation of in-vehicle communication which will be necessary to enable highly autonomous driving cars. Within this activity he is dealing with Ethernet and the data link layers
Jae-yong Chang is the in-vehicle-networking solution planner being responsible for defining the requirements for Keysight’s future IVN solutions and representing Keysight at various IVN standardization meetings. He is based in Colorado Springs, CO. He joined Hewlett-Packard Korea in 1990 as a R&D design engineer, and has held various positions in R&D, marketing and product planning in HP, Agilent Technologies and Keysight Technologies. He received his BA and MS degree in Physics from Sogang University, Seoul, Korea.
Alberto Rodríguez-Pérez (IEEE Member, 2008), received the B.S. degree in telecommunication engineering and the phD degree from the University of Seville, Spain, in 2007 and 2013, respectively. From 2008 to 2012, he worked towards his phD in the Institute of Microelectronics of Seville, Spain. He received a special recognition from the University of Seville at the end of his phD for the excellence of his research work. In 2013, he joined NXP Semiconductors in Eindhoven, The Netherlands, where he worked in the R&D department in the design of new and efficient topologies for high-speed serial interfaces transceivers for wireline communications. In 2014, he joined KDPOF Ltd., a start-up company settled in Madrid, Spain, which develops high speed optical communication systems. There, he started and leads the Analog & Mixed Signal department, in charge of developing the optoelectronics and the analog front-end for the optical transceivers. He was also an Associate Professor in the University Carlos III of Madrid, Spain from 2015 to 2018. Currently his main research interests are in the design of high-speed optical and wirelines transceivers, covering advanced modulation and equalization techniques, high-speed ADCs, high-speed PLLs, VCSEL and LED drivers and transimpedance amplifiers.