Event

Workshop

 

​When

10:00 - 12:30

 

Where

Room 1.06

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Abstract

The research area of improving the performance, cost and size of 5G RF solutions and evolution to 6G is very active with many developments and it is one of the driving factors for semiconductor industry. Mobile cellular subscribers reached more than 6 billion in 2022 and 5G LTE brings high data capacity as low latency using sub-6GHz and mm-Wave spectrum. Mm-Wave up to 300GHz will play a major role in future 6G networks. The proliferation of worldwide smartphones has been in part possible due to increased computational power of CMOS technology in lower feature nodes as 3nm/7nm. This has made also possible to essentially enhance RF CMOS through digital signal processing (DSP) and digital calibration. The workshop will cover 5G semiconductor technologies and architectures currently used in RF applications and the challenges for the 5G deployment as well the evolution to 6G.

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Organisers

Florinel Balteanu (Skyworks Solutions, US) 

Florinel Balteanu (M’98, SM’17) received the M.S. degree in electrical engineering from Polytechnic Institute, Bucharest, Romania, in 1983,  and the Ph.D. degree in electrical engineering from Transylvania University, Brasov, Romania, in 1995. From 1983 to 1992, he was with the Institute of Nuclear Research, Pitesti, Romania, working on electronic instrumentation for nuclear power reactors. In 1993, he joined the Department of Electronics, University of Pitesti, Romania, as an Assistant Professor doing research in analog circuits. From 1992 to 1993, he was a Fulbright Visiting Scholar at the Center for Reliable Computing, Stanford University, Stanford, CA. In 1996, he joined Philsar Semiconductor, Ottawa, ON, Canada, as a Senior ASIC Designer, a company later acquired by Conexant Systems, Inc. (now known as Skyworks Solutions, Inc.). His work has been focused on the design of radio circuits for GPS receivers, Bluetooth transceivers and GSM/CDMA cellular transceivers. He is presently a Technical Director with Skyworks Solutions Inc., Irvine, CA and is involved in designing circuits for Envelope Tracking and Front End Modules in CMOS and SOI CMOS. He presented short courses and tutorials as an Invited Speaker at IEEE Microwave Theory and Techniques Society (MTT-S) International Microwave Symposium (IMS). European Microwave Week (EuMW), European Solid-State Circuits Conference (ESSCIRC) and Asia-Pacific Microwave Conference (APMC). He holds 88 U.S. patents, with several more pending. He is author of the chapter “Envelope Tracking Techniques” in the IET book “Radio Frequency and Microwave Power Amplifiers, Vol. 2: Efficiency and Linearity”.

 

Andrei Grebennikov (Sumitomo, GB) 

Andrei Grebennikov (Senior Member of the IEEE) received his Dipl. Eng. degree in radio electronics from Moscow Institute of Physics and Technology, Moscow, Russia, in 1980, and Ph.D. degree in radio engineering from Moscow Technical University of Communications and Informatics, Moscow, Russia, in 1991. He obtained a long-term academic and industrial experience working with the Moscow Technical University of Communications and Informatics, Moscow, Russia, the Institute of Microelectronics, Singapore, M/A-COM, Cork, Ireland, Infineon Technologies, Munich, Germany, and Linz, Austria, Bell Labs, Alcatel-Lucent, Dublin, Ireland, and Microsemi, Aliso Viejo, California, as an Engineer, Researcher, Lecturer, and Educator. He has lectured as a Guest Professor with the University of Linz, Linz, Austria, and presented short courses and tutorials as an Invited Speaker at the IEEE Microwave Theory and Techniques Society (MTT-S) International Microwave Symposia (IMS), European and Asia-Pacific Microwave Conferences, the Institute of Microelectronics, Singapore, Motorola Design Centre, Penang, Malaysia, the Tomsk State University of Control Systems and Radioelectronics, Tomsk, Russia, and the Aachen Technical University, Aachen, Germany. He is an author and coauthor of more than 100 papers, holds 30 European and US patents, and authored 10 books dedicated to RF and microwave circuit design. Since 2016, he has been with Sumitomo Electric Europe Ltd, Elstree, UK.

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Program 

10:00 - 10:20

What is expecting from 6G circuits and transceivers?

Liang Liu (Lund University, SE), Lisbet Van der Perre (KU Leuven, BE)

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10:20 - 10:40

High versatile radios using AI for 6G bands and beyond

Francois Rivet (IMS Laboratory, Bordeaux, FR)

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10:40 - 11:00

Circuit technologies beyond 5G/6G

Shintaro Shinjo (Mitsubishi Electric Corporation, Kanagawa, JP)

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11:00 - 11:20

Technology developments toward 6G applications   

Baudouin Martineau (CEA-Leti, FR)

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11:20 - 11:40

CMOS mmWave DAC solutions for 5G and 6G

Victor Åberg, Christian Fager (Chalmers University, SE) 

 

11:40 - 12:00

RF-SOI and SiGe technologies for 5G+ and 6G Communications

Pascal Chevalier (STMicroelectronics, FR)

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12:00 - 12:20

Sub-THz transceiver design in CMOS

Kenichi Okada (Tokyo Institute of Technology, JP)

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12:20 - 12:30

5G transmitter circuits and evolution to 6G

Florinel Balteanu (Skyworks Solution, US)

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Biosketches

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Liang Liu is Associate Professor at the Department of Electronical and Information Technology, Lund University, Sweden. His main research interests are digital integrated circuit design and prototype systems development for wireless communication and machine learning applications. Liang Liu is active in several EU projects, including MiFuture, BEYOND5, REINDEER, and MAMMOET. Liang Liu is one of the main developers of the LuMaMi massive MIMO testbed. He is member of the Technical Committee for VLSI Systems and Applications and CAS for Communication of the IEEE Circuit and Systems Society.

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Dr. Francois Rivet received the Master's and Ph.D. degrees in 2005 and 2009 from the University of Bordeaux. Since June 2010, he has been tenured as an Associate Professor at the Bordeaux Institute of Technology (Bordeaux INP). His research is focused on the design of RFICs in the IMS Laboratory, the University of Bordeaux microelectronics laboratory. In 2014, he founded the "Circuits and Systems" research team. Dr. Rivet has publications in top-ranked journals, international conferences, and national conferences and holds 19 patents. He received the Best Paper Award at Software Defined Radio Forum in 2008 in Washington DC, USA, Journees Nationales Micro-ondes in 2015 and 2017, LASCAS in 2021 at Arequipa, Peru, and AVIC in 2022 in Hiroshima, Japan.

He is a member of several Technical Program Committees (RFIC, ESSCIRC, ...) and steering committees (RFIC, ICECS, LASCAS).

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Shintaro Shinjo received the B.S. and M.S. degrees in physics and Ph.D. degree in engineering from Keio University, Tokyo, Japan, in 1996, 1998, and 2011, respectively.  In 1998, he joined Mitsubishi Electric Corporation, Kamakura, Japan, where he has been involved in the research and development of microwave monolithic integrated circuits and solid-state power amplifiers. From 2011 to 2012, he was a visiting scholar with the University of California at San Diego, San Diego, CA, USA. From 2020 to 2022, he has worked as a researcher at the Minister of Education, Culture, Sports, Science and Technology (MEXT), Tokyo, Japan. He is currently a senior manager of Amplifier Group in Microwave Electronics Technology Department, Mitsubishi Electric Corporation, Kamakura, Japan.

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Christian Fager received his Ph.D. degrees from Chalmers University of Technology, Sweden, in 2003. He is a Full Professor at the same university and since 2020 the Head of the Microwave Electronics Laboratory. His research focuses on transmitters for future wireless systems.

Dr. Fager has authored and co-authored more than 200 papers in international journals and conferences. He currently serves as an Associate Editor of IEEE Microwave Magazine and IEEE Microwave and Wireless Technology Letters.

 

Baudouin Martineau received his Ph.D. degree in microwave and microtechnology from the University of Lille, France, in 2008. His Ph.D. thesis focused on the 65nm CMOS SOI potentialities for millimeter wave wireless applications. In 2008, he joined the Technology R&D department of STMicroelectronics, Crolles, France, as millimeter wave and RF design engineer. Since 2014, he is senior expert in RF & mmW design at CEA LETI research Institute and since 2023 the head of RF Architecture & IC Design Laboratory.

Dr. Martineau has authored and co-authored more than 50 IEEE publications and more than 25 patents.

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Victor Åberg received his B.S and M.S degrees in Electrical Engineering in 2014 and 2016 respectively and his Ph.D. degree in Computer Science and Engineering in 2022, all from Chalmers University of Technology, Sweden.

He is currently a post-doctoral researcher at the Department of Computer Science and Engineering at Chalmers University of Technology.

His research interests include wideband transmitters for centimeter and millimeter wave frequencies with a focus on linearity, efficiency, and a high level of integration. I also have an interest in high-speed data converters.

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Pascal Chevalier received the Ph.D. degree in electronics from the University of Lille, France, in 1998 for his work on InP-based HEMT. He joined Alcatel Microelectronics, Belgium, in 1999, where he contributed to the start of RF BiCMOS. Since joining STMicroelectronics, Crolles, France, in 2002, he has been working on the development of SiGe BiCMOS and RF-SOI CMOS technologies and related devices, with a long-lasting research interest in SiGe HBT. He is currently leading the RF-SOI CMOS, BiCMOS & Disruptive Technologies R&D team, and is a Fellow of Technical Staff. Dr. Chevalier has authored or co-authored over 200 technical journal papers and conference publications. He has served the Technical Program Committees of the IEEE Bipolar / BiCMOS Circuits and Technology Meeting (BCTM), the ECS SiGe Symposium, and the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS). He has been a member of the RF & AMS Technologies section of the ITRS of which he led the Silicon Bipolar & BiCMOS subgroup. He currently serves on the Technical Program Committee of the IEEE International Electron Devices Meeting (IEDM).

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Prof. Kenichi Okada received the B.E., M.E., and Ph.D. degrees from Kyoto University, Kyoto, Japan, in 1998, 2000, and 2003, respectively. He joined Tokyo Institute of Technology in 2003, and he is now Professor. He has authored and co-authored more than 500 journal and conference papers. His current research interests include millimeter-wave/terahertz wireless transceiver, digital PLL, and ultra-low-power RF circuits. He is/was a TPC member of ISSCC, VLSI Circuits, ESSCIRC, RFIC Symposium, A-SSCC, Guest Editors and Associate Editors of JSSC and T-MTT, a Distinguished Lecturer of SSCS, and IEEE Fellow.

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