W1: Technologies and Circuits for 5G evolution to 6G
Half day, 10:00
The research area of improving the performance, cost and size of 5G RF solutions and evolution to 6G is very active with many developments and it is one of the driving factors for semiconductor industry. Mobile cellular subscribers reached more than 6 billion in 2022 and 5G LTE brings high data capacity as low latency using sub-6GHz and mm-Wave spectrum. Mm-Wave up to 300GHz will play a major role in future 6G networks. The proliferation of worldwide smartphones has been in part possible due to increased computational power of CMOS technology in lower feature nodes as 3nm/7nm. This has made also possible to essentially enhance RF CMOS through digital signal processing (DSP) and digital calibration. The workshop will cover 5G semiconductor technologies and architectures currently used in RF applications and the challenges for the 5G deployment as well the evolution to 6G.
Florinel Balteanu (Skyworks Solutions, UK)
Andrei Grebennikov (Sumitomo, UK)
Florinel Balteanu (M’98, SM’17) received the M.S. degree in electrical engineering from Polytechnic Institute, Bucharest, Romania, in 1983, and the Ph.D. degree in electrical engineering from Transylvania University, Brasov, Romania, in 1995. From 1983 to 1992, he was with the Institute of Nuclear Research, Pitesti, Romania, working on electronic instrumentation for nuclear power reactors. In 1993, he joined the Department of Electronics, University of Pitesti, Romania, as an Assistant Professor doing research in analog circuits. From 1992 to 1993, he was a Fulbright Visiting Scholar at the Center for Reliable Computing, Stanford University, Stanford, CA. In 1996, he joined Philsar Semiconductor, Ottawa, ON, Canada, as a Senior ASIC Designer, a company later acquired by Conexant Systems, Inc. (now known as Skyworks Solutions, Inc.). His work has been focused on the design of radio circuits for GPS receivers, Bluetooth transceivers and GSM/CDMA cellular transceivers. He is presently a Technical Director with Skyworks Solutions Inc., Irvine, CA and is involved in designing circuits for Envelope Tracking and Front End Modules in CMOS and SOI CMOS. He presented short courses and tutorials as an Invited Speaker at IEEE Microwave Theory and Techniques Society (MTT-S) International Microwave Symposium (IMS). European Microwave Week (EuMW), European Solid-State Circuits Conference (ESSCIRC) and Asia-Pacific Microwave Conference (APMC). He holds 88 U.S. patents, with several more pending. He is author of the chapter “Envelope Tracking Techniques” in the IET book “Radio Frequency and Microwave Power Amplifiers, Vol. 2: Efficiency and Linearity”.